Roudenko J, Schirmer J, Reichenberger M, Neermann S, Franke J (2018)
Publication Type: Conference contribution
Publication year: 2018
DOI: 10.1109/ICMID.2018.8527048
APA:
Roudenko, J., Schirmer, J., Reichenberger, M., Neermann, S., & Franke, J. (2018). Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates. In IEEE (Eds.), Proceedings of the 13th International Congress Molded Interconnect Devices (MID).
MLA:
Roudenko, Jewgeni, et al. "Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates." Proceedings of the 13th International Congress Molded Interconnect Devices (MID) Ed. IEEE, 2018.
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