Bräuer P, Kuhn T, Müller M, Franke J (2019)
Publication Type: Conference contribution
Publication year: 2019
Publisher: IEEE
Edited Volumes: International Spring Seminar on Electronics Technology, ISSE 2019 -- 2019 42th International Spring Seminar
City/Town: NEW YORK
Pages Range: 1--6
Conference Proceedings Title: 2019 42ND INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE)
URI: https://ieeexplore.ieee.org/document/8810264
DOI: 10.1109/ISSE.2019.8810264
APA:
Bräuer, P., Kuhn, T., Müller, M., & Franke, J. (2019). Reliability of Molded Interconnect Devices regarding Crack Initiation and Overmolding. In 2019 42ND INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) (pp. 1--6). Wroclaw, PL: NEW YORK: IEEE.
MLA:
Bräuer, Philipp, et al. "Reliability of Molded Interconnect Devices regarding Crack Initiation and Overmolding." Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2019 -- 2019 42th International Spring Seminar, Wroclaw NEW YORK: IEEE, 2019. 1--6.
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