Ostendorf A, Kulik C, Zeadan M, Schmidt M, Horn M (2002)
Publication Type: Conference contribution
Publication year: 2002
Publisher: Meisenbach Verlag
Pages Range: 187-200
Conference Proceedings Title: 5th International Congress on Molded interconnect Devices (MID)
Event location: Bamberg
APA:
Ostendorf, A., Kulik, C., Zeadan, M., Schmidt, M., & Horn, M. (2002). Laser Spot Welding and Soldering of Micro Components to 3-Dimensional Circuit Substrates. In Feldmann, K.; Meier, R.; Römer, M.; Zippmann, V. (Eds.), 5th International Congress on Molded interconnect Devices (MID) (pp. 187-200). Bamberg: Meisenbach Verlag.
MLA:
Ostendorf, A., et al. "Laser Spot Welding and Soldering of Micro Components to 3-Dimensional Circuit Substrates." Proceedings of the 5th International Congress on Molded interconnect Devices (MID), Bamberg Ed. Feldmann, K.; Meier, R.; Römer, M.; Zippmann, V., Meisenbach Verlag, 2002. 187-200.
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