Umar Z, Engelsberger FX, Wojnowski M, Hagelauer AM, Weigel R (2018)
Publication Type: Conference contribution
Publication year: 2018
Publisher: IEEE
City/Town: NEW YORK
Pages Range: 634-637
Conference Proceedings Title: 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC)
DOI: 10.1109/eptc.2018.8654356
APA:
Umar, Z., Engelsberger, F.X., Wojnowski, M., Hagelauer, A.M., & Weigel, R. (2018). Analysis of Low Profile Ferrite Material Based Planar Shell Core Inductor. In 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) (pp. 634-637). Singapore, SG: NEW YORK: IEEE.
MLA:
Umar, Zeeshan, et al. "Analysis of Low Profile Ferrite Material Based Planar Shell Core Inductor." Proceedings of the 20th IEEE Electronics Packaging Technology Conference (EPTC), Singapore NEW YORK: IEEE, 2018. 634-637.
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