Dynamic grain coarsening in creep of pure Cu at 0.42 T-m after predeformation by ECAP

Blum W, Dvorak J, Kral P, Sklenicka V (2018)

Publication Status: Published

Publication Type: Journal article

Publication year: 2018

Journal

Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing Elsevier

Publisher: ELSEVIER SCIENCE SA

Book Volume: 731

Pages Range: 520-529

DOI: 10.1016/j.msea.2018.05.026

Abstract

Microcrystalline Cu99.99 produced by equal channel angular pressing and static recrystallization was deformed in tensile and compressive creep at 573 K. Discontinuous coarsening of grains led to dramatic changes of creep rate. These reflect general hardening as the grains coarsen, superimposed by transient net softening when grain boundary migration activity peaks. The strength at the first minimum of creep rate is modeled by treating the material as a composite of subgrain-free and subgrain-containing grains with different recovery kinetics.

Authors with CRIS profile

Wolfgang Blum Technische Fakultät

Additional Organisation(s)

Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)

Involved external institutions

Academy of Sciences of the Czech Republic (ASCR) / Akademie věd České republiky (AVČR) CZ Czech Republic (CZ)

How to cite

APA:

Blum, W., Dvorak, J., Kral, P., & Sklenicka, V. (2018). Dynamic grain coarsening in creep of pure Cu at 0.42 T-m after predeformation by ECAP. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 731, 520-529. https://doi.org/10.1016/j.msea.2018.05.026

MLA:

Blum, Wolfgang, et al. "Dynamic grain coarsening in creep of pure Cu at 0.42 T-m after predeformation by ECAP." Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing 731 (2018): 520-529.

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