Schmidbauer P, Wojnowski M, Weigel R, Hagelauer AM (2018)
Publication Language: English
Publication Type: Conference contribution, Conference Contribution
Publication year: 2018
Pages Range: 285-287
Conference Proceedings Title: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
DOI: 10.1109/EPEPS.2018.8534303
We prove design concepts for embedded wafer level ball grid array package integrated circularly polarized antennas in the 57 GHz to 64 GHz ISM band. Therefore, we propose performance requirements and evaluate the properties of four different antenna-in-package layouts based on electromagnetic full-wave simulations with focus on the axial ratio characteristics.
APA:
Schmidbauer, P., Wojnowski, M., Weigel, R., & Hagelauer, A.M. (2018). Wafer Level Package Integrated Antenna Concepts for Circular Polarization. In IEEE (Eds.), 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (pp. 285-287). San Jose, CA, US.
MLA:
Schmidbauer, Philipp, et al. "Wafer Level Package Integrated Antenna Concepts for Circular Polarization." Proceedings of the 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA Ed. IEEE, 2018. 285-287.
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