Lomakin K, Sippel M, Gold G, Ringel J, Weiß D, Helmreich K, Ankenbrand M, Franke J (2018)
Publication Language: English
Publication Type: Conference contribution
Publication year: 2018
Conference Proceedings Title: German Microwave Conference
DOI: 10.23919/gemic.2018.8335106
This work shows a comparison of microstrip to integrated circuits junction between conventional bond wires and additively manufactured signal interconnect. Therefore, an approach for reducing signal reflection is proposed and implemented on a test board fabricated on typical radio frequency substrate material. Measurements up to 24 GHz reveal improved performance as compared to conventional technology in terms of reflection suppression and transmission losses.
APA:
Lomakin, K., Sippel, M., Gold, G., Ringel, J., Weiß, D., Helmreich, K.,... Franke, J. (2018). Substituting bond wires by additively manufactured interconnections. In German Microwave Conference.
MLA:
Lomakin, Konstantin, et al. "Substituting bond wires by additively manufactured interconnections." Proceedings of the German Microwave Conference 2018.
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