Bach J, Liebig JP, Höppel HW, Blum W (2013)
Publication Type: Journal article
Publication year: 2013
Book Volume: 93
Pages Range: 4331-4354
Journal Issue: 35
DOI: 10.1080/14786435.2013.828161
APA:
Bach, J., Liebig, J.P., Höppel, H.W., & Blum, W. (2013). Influence of grain boundaries on the deformation resistance: Insights from an investigation of deformation kinetics and microstructure of copper after predeformation by ECAP. Philosophical Magazine, 93(35), 4331-4354. https://doi.org/10.1080/14786435.2013.828161
MLA:
Bach, Jochen, et al. "Influence of grain boundaries on the deformation resistance: Insights from an investigation of deformation kinetics and microstructure of copper after predeformation by ECAP." Philosophical Magazine 93.35 (2013): 4331-4354.
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