Sieroshtan V, Sevskiy G, Komakha P, Aleksieiev O, Burygin A, Chayka O, Ruban O, Shevelov M, Kato K, Horibe A, Fujioka H, Ruffing K, Heide P, Vossiek M (2012)
Publication Language: English
Publication Status: Published
Publication Type: Conference contribution, Conference Contribution
Publication year: 2012
Pages Range: 1131-1134
Event location: San Diego, CA
URI: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84876943268&origin=inward
This paper presents a novel ultra-compact System-in-Package (SiP) module with highly integrated wireless connectivity devices combining a set of 4 standards: WLAN, Bluetooth, FM and GPS. Besides an IC, the SiP module consists of RF filters, SMD components and a Single-Chip RF Front-end. The main IC is embedded inside the substrate and basics of SESUB technology are described. For electromagnetic compatibility and physical protection a metal EMI shield has been used. The total size of solution presented is 8.0×7.5×1. 3mm demonstrating significant miniaturization over current module technology. The embedding process and SiP module routing has shown benefits in electrical and mechanical performance.
APA:
Sieroshtan, V., Sevskiy, G., Komakha, P., Aleksieiev, O., Burygin, A., Chayka, O.,... Vossiek, M. (2012). Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology. In Proceedings of the 45th Annual International Symposium on Microelectronics, IMAPS 2012 (pp. 1131-1134). San Diego, CA.
MLA:
Sieroshtan, V., et al. "Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology." Proceedings of the 45th Annual International Symposium on Microelectronics, IMAPS 2012, San Diego, CA 2012. 1131-1134.
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