Sippel M, Lomakin K, Gold G, Reitberger T, Neermann S, Helmreich K (2017)
Publication Language: English
Publication Type: Conference contribution
Publication year: 2017
Conference Proceedings Title: 21st IEEE Workshop on Signal and Power Integrity (SPI 2017)
Event location: Baveno, IT
DOI: 10.1109/SaPIW.2017.7944043
APA:
Sippel, M., Lomakin, K., Gold, G., Reitberger, T., Neermann, S., & Helmreich, K. (2017). Simple Approach for brief RF Characterization of thin 3D printable Dielectrics. In 21st IEEE Workshop on Signal and Power Integrity (SPI 2017). Baveno, IT.
MLA:
Sippel, Mark, et al. "Simple Approach for brief RF Characterization of thin 3D printable Dielectrics." Proceedings of the 21st IEEE Workshop on Signal and Power Integrity (SPI 2017), Baveno, IT 2017.
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