Seler E, Wojnowski M, Weigel R, Hagelauer AM (2013)
Publication Type: Conference contribution
Publication year: 2013
Publisher: IEEE
Pages Range: 43-46
Conference Proceedings Title: IEEE Conference Electrical Performance of Electronic Packaging and Systems
DOI: 10.1109/EPEPS.2013.6703463
APA:
Seler, E., Wojnowski, M., Weigel, R., & Hagelauer, A.M. (2013). New Simulation Procedure for Accurate Package Modeling Considering Chip-Package Interaction. In IEEE Conference Electrical Performance of Electronic Packaging and Systems (pp. 43-46). San Jose, US: IEEE.
MLA:
Seler, Ernst, et al. "New Simulation Procedure for Accurate Package Modeling Considering Chip-Package Interaction." Proceedings of the IEEE Conference Electrical Performance of Electronic Packaging and Systems, San Jose IEEE, 2013. 43-46.
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