A 29 GHz frequency divider in a miniaturized leadless flip-chip plastic package
Engl M, Pressel K, Dangelmaier J, Theuss H, Eisener B, Eurskens W, Knapp H, Simbürger W, Weigel R (2004)
Publication Type: Conference contribution
Publication year: 2004
Book Volume: 2
Pages Range: 477-480
Conference Proceedings Title: IEEE MTT-S International Microwave Symposium Digest
Event location: Fort Worth, Texas
DOI: 10.1109/MWSYM.2004.1336016
Abstract
We present a static frequency divider operating up to 29 GHz in a tiny leadless plastic package. This innovative package, which is intended for high volume production at low cost, has an ultra-miniaturized footprint with a standard pad pitch of 0.5 mm and a standard package height of 0.4 mm. To demonstrate the high frequency capabilities of the package we show the performance up to 29 GHz of a frequency divider with a divide ratio of 16. The circuit is manufactured in a standard SiGe BiCMOS technology for volume production (Infineon B7HFC).
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Germany (DE)How to cite
APA:
Engl, M., Pressel, K., Dangelmaier, J., Theuss, H., Eisener, B., Eurskens, W.,... Weigel, R. (2004). A 29 GHz frequency divider in a miniaturized leadless flip-chip plastic package. In IEEE MTT-S International Microwave Symposium Digest (pp. 477-480). Fort Worth, Texas.
MLA:
Engl, Mario, et al. "A 29 GHz frequency divider in a miniaturized leadless flip-chip plastic package." Proceedings of the IEEE MTT-S International Microwave Symposium Digest, Fort Worth, Texas 2004. 477-480.
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