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Evaluation of Calibration Techniques for High Resolution Time Domain Semiconductor Package Characterization

Engl M, Eurskens W, Weigel R (2005)

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Publication Type: Conference contribution

Publication year: 2005

Conference Proceedings Title: 14th Topical Meeting on Electrical Performance of Electronic Packaging

Event location: Austin, USA

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How to cite

APA:

Engl, M., Eurskens, W., & Weigel, R. (2005). Evaluation of Calibration Techniques for High Resolution Time Domain Semiconductor Package Characterization. In 14th Topical Meeting on Electrical Performance of Electronic Packaging. Austin, USA.

MLA:

Engl, Mario, Wolfram Eurskens, and Robert Weigel. "Evaluation of Calibration Techniques for High Resolution Time Domain Semiconductor Package Characterization." Proceedings of the 14th Topical Meeting on Electrical Performance of Electronic Packaging, Austin, USA 2005.

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