Evaluation of Wirebond and Flip-Chip Unterconnects of a Leadless Plastic Package for RF Applications

Engl M, Pressel K, Theuss H, Dangelmaier J, Eurskens W, Knapp H, Simbürger W, Weigel R (2005)

Publication Type: Conference contribution

Publication year: 2005

Publisher: IEEE

Book Volume: 1

Conference Proceedings Title: Electronic Packaging Technology Conference, 2005. EPTC

Event location: Singapore

Authors with CRIS profile

Robert Weigel Lehrstuhl für Technische Elektronik

Involved external institutions

Infineon Technologies AG DE Germany (DE)

How to cite

APA:

Engl, M., Pressel, K., Theuss, H., Dangelmaier, J., Eurskens, W., Knapp, H.,... Weigel, R. (2005). Evaluation of Wirebond and Flip-Chip Unterconnects of a Leadless Plastic Package for RF Applications. In Electronic Packaging Technology Conference, 2005. EPTC. Singapore: IEEE.

MLA:

Engl, Mario, et al. "Evaluation of Wirebond and Flip-Chip Unterconnects of a Leadless Plastic Package for RF Applications." Proceedings of the Electronic Packaging Technology Conference, 2005. EPTC, Singapore IEEE, 2005.

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