SystemC Modelling and Simulation of Highly Integrated Baseband ICs for 2.5th Generation Mobile Phones

Huemer M, Bichler D, Dorfmair W, Knauseder R, Osterkorn C, Lüftner T (2003)

Publication Type: Conference contribution

Publication year: 2003

Pages Range: 29-32

Conference Proceedings Title: Austrochip 2003

Event location: Linz, Austria

Abstract

The dramatical increase of chip­internal data traffic in baseband processors for multimedia­oriented mobile phones or PDAs requires highly sophisticated tools and simulation platforms, which allow to model and optimize the overall chip architecture in a convenient way. In this contribution we present a SystemC based simulation platform, which represents a basic and easy extensible model for simulation and optimization of FIFO buffer sizes, clock­, bus­ and DMA­concepts. We briefly present the basic system model, the implementation with SystemC, and we also present simulation results of a simple test scenario.

Involved external institutions

Infineon Technologies AG DE Germany (DE)

How to cite

APA:

Huemer, M., Bichler, D., Dorfmair, W., Knauseder, R., Osterkorn, C., & Lüftner, T. (2003). SystemC Modelling and Simulation of Highly Integrated Baseband ICs for 2.5th Generation Mobile Phones. In Austrochip 2003 (pp. 29-32). Linz, Austria.

MLA:

Huemer, Mario, et al. "SystemC Modelling and Simulation of Highly Integrated Baseband ICs for 2.5th Generation Mobile Phones." Proceedings of the Austrochip 2003, Linz, Austria 2003. 29-32.

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