Identification of Microwave Device and Packaging Models from Frequency Response Data
Neumayer R, Stelzer A, Weigel R (2003)
Publication Type: Conference contribution
Publication year: 2003
Book Volume: 2
Pages Range: 961-965
Conference Proceedings Title: Proceedings International Microwave and Optoelectronics Conference (IMOC), 2003
Event location: Iguazu, BR
DOI: 10.1109/IMOC.2003.1242711
Abstract
As system integration evolves and package densities increases, it becomes increasingly important to model non-ideal behavior of previously neglected frequency-domain effects of the microwave components and packaging interconnects. This paper addresses the generation of SPICE-based circuit models from frequency-domain response parameters. In particular, a recently developed subspace identification algorithm is applied to generate passive multi-port models of microwave devices and packages characterized by measured or simulated network parameters. Results of the application of the proposed method applied to real-world examples are given.
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Austria (AT)How to cite
APA:
Neumayer, R., Stelzer, A., & Weigel, R. (2003). Identification of Microwave Device and Packaging Models from Frequency Response Data. In Proceedings International Microwave and Optoelectronics Conference (IMOC), 2003 (pp. 961-965). Iguazu, BR.
MLA:
Neumayer, Roland, Andreas Stelzer, and Robert Weigel. "Identification of Microwave Device and Packaging Models from Frequency Response Data." Proceedings of the Proceedings International Microwave and Optoelectronics Conference (IMOC), 2003, Iguazu, BR 2003. 961-965.
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