The impact of embedded wafer level BGA package on the antenna hemispherical lens characterization for wireless applications at 61 GHz

Pour Mousavi SM, Wojnowski M, Roehr S, Sommer G, Weigel R (2013)

Publication Type: Conference contribution

Publication year: 2013

Event location: Sweden SE

Authors with CRIS profile

Seyed Mehran Pour Mousavi Lehrstuhl für Technische Elektronik Robert Weigel Lehrstuhl für Technische Elektronik

How to cite

APA:

Pour Mousavi, S.M., Wojnowski, M., Roehr, S., Sommer, G., & Weigel, R. (2013). The impact of embedded wafer level BGA package on the antenna hemispherical lens characterization for wireless applications at 61 GHz. In Proceedings of the European Conference of Antennas and Propagation (EuCAP). Sweden, SE.

MLA:

Pour Mousavi, Seyed Mehran, et al. "The impact of embedded wafer level BGA package on the antenna hemispherical lens characterization for wireless applications at 61 GHz." Proceedings of the European Conference of Antennas and Propagation (EuCAP), Sweden 2013.

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