Hagelauer AM, Wojnowski M, Pressel K, Weigel R, Kissinger D (2018)
Publication Language: English
Publication Type: Journal article, Review article
Publication year: 2018
Book Volume: 19
Pages Range: 48-56
Journal Issue: 1
APA:
Hagelauer, A.M., Wojnowski, M., Pressel, K., Weigel, R., & Kissinger, D. (2018). Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies. IEEE Microwave Magazine, 19(1), 48-56. https://doi.org/10.1109/MMM.2017.2759558
MLA:
Hagelauer, Amelie Marietta, et al. "Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies." IEEE Microwave Magazine 19.1 (2018): 48-56.
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