Vossiek M, Heide P (2000)
Publication Type: Conference contribution
Publication year: 2000
Conference Proceedings Title: IWPC Future Automotive Wireless Packaging Workshop
Event location: Dearborn, USA
APA:
Vossiek, M., & Heide, P. (2000). Microwave Sensor Modules for Automotive Applications. In IWPC Future Automotive Wireless Packaging Workshop. Dearborn, USA.
MLA:
Vossiek, Martin, and Patric Heide. "Microwave Sensor Modules for Automotive Applications." Proceedings of the IWPC Future Automotive Wireless Packaging Workshop, Dearborn, USA 2000.
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