Schramm R, Reitberger T, Franke J (2015)
Publication Status: Published
Publication Type: Journal article, Original article
Publication year: 2015
Publisher: IMAPS-International Microelectronics and Packaging Society
Book Volume: 12
Pages Range: 61-66
Journal Issue: 1
DOI: 10.4071/imaps.445
APA:
Schramm, R., Reitberger, T., & Franke, J. (2015). Electrical and mechanical investigations on copper circuit paths coated on fiber-reinforced plastics by atmospheric plasma technology. Journal of Microelectronics and Electronic Packaging, 12(1), 61-66. https://doi.org/10.4071/imaps.445
MLA:
Schramm, René, Thomas Reitberger, and Jörg Franke. "Electrical and mechanical investigations on copper circuit paths coated on fiber-reinforced plastics by atmospheric plasma technology." Journal of Microelectronics and Electronic Packaging 12.1 (2015): 61-66.
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