Nisznansky M, Ziegler C, Martius S, Schmidt LP, Müller J (2002)
Publication Type: Conference contribution
Publication year: 2002
Edited Volumes: Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
City/Town: Castelvecchio Pascoli - Pisa, Italy
Pages Range: 161-163
Conference Proceedings Title: Signal Propagation on Interconnects
Event location: Pisa
Results of electromagnetic simulations and measurements of simple interconnect structure are discussed in this paper. The presented structure was realised on LTCC multilayer board which are suitable for manufacturing of multichip modules for next generation communication systems with clock rates in the 10-100GHz range. From the presented results it is possible to obtain an impression about distortion of high speed digital signals after passing this or similar interconnect structures. Precision microwave measurement techniques that are important for verification of such simulations are discussed, too. © 2002 IEEE.
APA:
Nisznansky, M., Ziegler, C., Martius, S., Schmidt, L.-P., & Müller, J. (2002). Simulation and Measurement of Interconnect Structures for High Speed Digital Systems. In Signal Propagation on Interconnects (pp. 161-163). Pisa: Castelvecchio Pascoli - Pisa, Italy.
MLA:
Nisznansky, Martin, et al. "Simulation and Measurement of Interconnect Structures for High Speed Digital Systems." Proceedings of the 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, Pisa Castelvecchio Pascoli - Pisa, Italy, 2002. 161-163.
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