Embedded Wafer Level Ball Grid Array (eWLB) Technology for Millimeter-Wave Applications
Wojnowski M, Lachner R, Böck J, Wagner C, Starzer F, Sommer G, Pressel K, Weigel R (2011)
Publication Type: Conference contribution
Publication year: 2011
Pages Range: 423-429
Conference Proceedings Title: IEEE 13th Electronics Packaging Technology Conference (EPTC)
Event location: Singapore, SG
ISBN: 978-1-4577-1981-3
DOI: 10.1109/EPTC.2011.6184458
Abstract
The embedded wafer level ball grid array (eWLB) is a novel packaging technology that shows excellent performance for millimeter-wave (mm-wave) applications. We present simulation and measurement results of single-ended and differential transmission lines realized using the thin-film redistribution layers (RDL) of an eWLB. We demonstrate the capabilities for the integration of passives on example of a configurable 17/18 GHz down-converter circuit realized in silicon-germanium (SiGe) technology with a fan-in eWLB differential inductor used for the LC tank. We compare the performance of differential chip-package-board transitions realized in an eWLB and in other common package types. We report an optimized compact chip-package-board transition in the eWLB. We obtain a simulated insertion loss as low as -0.65 dB and a return loss below -16 dB at 77 GHz without external matching networks. We introduce the concept of antenna integration in the eWLB and show examples of single-ended and differential antenna structures. Finally, we present for the first time a single-chip four-channel 77 GHz transceiver in SiGe integrated in the eWLB package together with four dipole antennas. The presented examples demonstrate that the eWLB technology is an attractive candidate for mm-wave applications including system-in-package (SiP).
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Germany (DE)How to cite
APA:
Wojnowski, M., Lachner, R., Böck, J., Wagner, C., Starzer, F., Sommer, G.,... Weigel, R. (2011). Embedded Wafer Level Ball Grid Array (eWLB) Technology for Millimeter-Wave Applications. In IEEE 13th Electronics Packaging Technology Conference (EPTC) (pp. 423-429). Singapore, SG.
MLA:
Wojnowski, Maciej, et al. "Embedded Wafer Level Ball Grid Array (eWLB) Technology for Millimeter-Wave Applications." Proceedings of the IEEE 13th Electronics Packaging Technology Conference (EPTC), Singapore, SG 2011. 423-429.
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