Steinecke T, Goekcen M, Hesidenz D, Gstöttner A (2007)
Publication Type: Conference contribution
Publication year: 2007
Publisher: IEEE
Pages Range: 1-6
Conference Proceedings Title: International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Event location: Torino, Italy
The electromagnetic emission of complex very large scale integrated circuits is determined by their operation activity plus the manifold noise propagation paths through the on-chip power routing, the package traces and the planes and traces on the printed circuit board. The design of any emission test board influences the emission finally measured at defined probing connectors. Good simulation models have to serve two main interests: (1) identification of emission-related IC design weaknesses and estimation of measured emission from the IC manufacturer's point of view and (2) identification of emission- related application board design weaknesses and estimation of measured emission from the system manufacturer's point of view. This paper presents a target-leading approach for a full system emission simulation model which serves both the IC and system manufacturer's interests. The simulation model has been created and verified for a 32-bit automotive microcontroller containing 30 million transistors.
APA:
Steinecke, T., Goekcen, M., Hesidenz, D., & Gstöttner, A. (2007). High-Accuracy Emission Simulation Models for VLSI Chips including Package and Printed Circuit Board. In International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) (pp. 1-6). Torino, Italy: IEEE.
MLA:
Steinecke, Thomas, et al. "High-Accuracy Emission Simulation Models for VLSI Chips including Package and Printed Circuit Board." Proceedings of the International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Torino, Italy IEEE, 2007. 1-6.
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