Engl M, Eurskens W, Weigel R (2004)
Publication Type: Conference contribution
Publication year: 2004
Conference Proceedings Title: Electronics Packing Technology Conference
Event location: Singapore
As operating frequencies rise and supply voltages decrease, the electrical performance of packages becomes more and more important. Hence, parasitic effects and electrical characterization of packages play an important role for todays and future applications. In this paper, we describe a state-of-the-art Time Domain Reflectometry measurement technique and evaluate its applicability tn package characterization. Furthermore, we compare the results obtained from a conventional Time Domain Reflectometer (TDR) with that of a Vector Network Analyzer fVNA). Since the VNA is actually operating in frequency domain, its results are transformed to time domain. As test samples, several packages containing integrated circuits with defined standards like short, open and load were measured. The results show that Time Domain Reflectometry techniques are well suited for failure analysis and package characterization. Besides it turned out that the results from the VNA are superior.
APA:
Engl, M., Eurskens, W., & Weigel, R. (2004). Comparison of time domain package characterization techniques using TDR and VNA. In Electronics Packing Technology Conference. Singapore.
MLA:
Engl, Mario, Wolfram Eurskens, and Robert Weigel. "Comparison of time domain package characterization techniques using TDR and VNA." Proceedings of the Electronics Packing Technology Conference, Singapore 2004.
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