An Investigation of the Proximity Effect of Millimeter-Wave MMICs in Flip-Chip Configuration
Nagy O, Heide P, Springer A, Weigel R (2001)
Publication Type: Conference contribution
Publication year: 2001
Publisher: IEEE
Pages Range: 1-4
Conference Proceedings Title: IEEE : European Microwave Conference
Event location: London, GB
Abstract
A comparison between flip-chip mounting of monolithic microwave integrated circuits (MMICs) in microstrip transmission line technology and coplanar transmission line technology is presented. The influence of substrate proximity effects on the electrical behavior of the MMICs is examined and illustrated in normalized frequency independent graphs. Based on the results of this work, the performance of microstrip-MMICs used in flip-chip configuration can be estimated as a function of the chosen assembly geometry.
Authors with CRIS profile
Involved external institutions
Austria (AT)How to cite
APA:
Nagy, O., Heide, P., Springer, A., & Weigel, R. (2001). An Investigation of the Proximity Effect of Millimeter-Wave MMICs in Flip-Chip Configuration. In IEEE : European Microwave Conference (pp. 1-4). London, GB: IEEE.
MLA:
Nagy, Oliver, et al. "An Investigation of the Proximity Effect of Millimeter-Wave MMICs in Flip-Chip Configuration." Proceedings of the IEEE : European Microwave Conference, London, GB IEEE, 2001. 1-4.
BibTeX: Download