Röhrl FX, Jakob J, Bogner W, Weigel R, Zorn S (2018)
Publication Language: English
Publication Status: Accepted
Publication Type: Conference contribution, Conference Contribution
Future Publication Type: Conference contribution
Publication year: 2018
Publisher: IEEE
Pages Range: 4
ISBN: 978-2-87487-051-4
URI: https://ieeexplore.ieee.org/document/8541697
DOI: 10.23919/EuMC.2018.8541697
Open Access Link: https://ieeexplore.ieee.org
This paper presents a comparison of chip connections using Aerosol Jet (AJ) and Bond technology on low cost PCB substrates. First, the behavior of the used gap filler material and the used silver ink on printed circuit boards are characterized. In addition to comparing the RF performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size and adhesion) on the PCB, the bonding technology has clear advantages, especially with different coefficient of thermal expansion (CTE) values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of aerosol jet and once by bonding wires.
APA:
Röhrl, F.X., Jakob, J., Bogner, W., Weigel, R., & Zorn, S. (2018). Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications. In Proceedings of the European Microwave Conference (pp. 4). Madrid, ES: IEEE.
MLA:
Röhrl, Franz Xaver, et al. "Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications." Proceedings of the European Microwave Conference, Madrid IEEE, 2018. 4.
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