Felfer P, Scherrer B, Demeulemeester J, Vandervorst W, Cairney JM (2015)
Publication Status: Published
Publication Type: Conference contribution
Publication year: 2015
Publisher: Elsevier
Book Volume: 159
Pages Range: 438-444
DOI: 10.1016/j.ultramic.2015.06.002
Using modern wide-angle atom probes, it is possible to acquire atomic scale 3D data containing 1000 s of nm(2) of interfaces. It is therefore possible to probe the distribution of segregated species across these interfaces. Here, we present techniques that allow the production of models for interfacial excess (IE) mapping and discuss the underlying considerations and sampling statistics. We also show, how the same principles can be used to achieve thickness mapping of thin films. We demonstrate the effectiveness on example applications, including the analysis of segregation to a phase boundary in stainless steel, segregation to a metal-ceramic interface and the assessment of thickness variations of the gate oxide in a fin-FET. (C) 2015 Elsevier B.V. All rights reserved.
APA:
Felfer, P., Scherrer, B., Demeulemeester, J., Vandervorst, W., & Cairney, J.M. (2015). Mapping interfacial excess in atom probe data. (pp. 438-444). Elsevier.
MLA:
Felfer, Peter, et al. "Mapping interfacial excess in atom probe data." Elsevier, 2015. 438-444.
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