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Marcel Sippel
List of publications:
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Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Publications
(18)
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Journal article
Journal article
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Book chapter / Article in edited volumes
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Authored book
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Translation
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Thesis
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Conference contribution
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Unpublished / Preprint
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Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication (2024)
Utsch D, Sippel M, Voigt C, Häußler F, Franke J
Journal article
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle (2024)
Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J
Journal article
Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024)
Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J
Conference contribution
Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography (2023)
Käsbauer M, Dreher P, Sippel M, Schmidt R
Journal article
Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics (2023)
Utsch D, Häußler F, Voigt C, Sippel M, Franke J
Conference contribution, Conference Contribution
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications (2023)
Alzoubi K, Hensel A, Häußler F, Ottinger B, Sippel M, Franke J
Journal article
A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing (2023)
Ockel M, Sippel M, Hecht C, Janisch L, Franke J
Conference contribution, Conference Contribution
Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds (2023)
Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J
Conference contribution
High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints (2022)
Häußler F, Sippel M, Sprenger M, Liu L, Muckelbauer M, Franke J
Conference contribution
2-D Fluid Simulation Approach for Miniwave Soldering (2022)
Seidel R, Sippel M, Franke J
Conference contribution
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