Dr. Jens Hauch



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Nondestructive characterization of polymeric components of silicon solar modules by near-infrared absorption spectroscopy (NIRA) (2020) Stroyuk O, Buerhop-Lutz C, Vetter A, Hauch J, Brabec C Journal article Robot-Based High-Throughput Screening of Antisolvents for Lead Halide Perovskites (2020) Gu E, Tang X, Langner S, Duchstein P, Zhao Y, Levchuk I, Kalancha V, et al. Journal article Quantitative Analysis of the Separate Influences of Material Composition and Local Defects on the Voc of PV Devices: An Exemplary Study on CIGS (2020) Hepp J, Vetter A, Hofbeck B, Sultan U, Hauch J, Camus C, Brabec C Journal article Does Covid-19 Impact Photovoltaics? (2020) Peters IM, Brabec C, Buonassisi T, Hauch J, Nobre AM Conference contribution Device Performance of Emerging Photovoltaic Materials (Version 1) (2020) Almora O, Baran D, Bazan GC, Berger C, Cabrera CI, Catchpole KR, Erten-Ela S, et al. Journal article Material Strategies to Accelerate OPV Technology Toward a GW Technology (2020) Brabec C, Distler A, Du X, Egelhaaf HJ, Hauch J, Heumüller T, Li N Journal article Standardization as an Instrument to Accelerate the Development of Stable Emerging Photovoltaic Technologies—The IEC TS 62876-2-1:2018—Technical Specification for the Stability Testing of Photovoltaic Devices Enabled by Nanomaterials (2020) Hauch J, Brabec C, Fabricius N, Bergholz W Journal article The Impact of COVID-19-Related Measures on the Solar Resource in Areas with High Levels of Air Pollution (2020) Peters IM, Brabec C, Buonassisi T, Hauch J, Nobre AM Journal article Beyond Ternary OPV: High-Throughput Experimentation and Self-Driving Laboratories Optimize Multicomponent Systems (2020) Langner S, Häse F, Perea JD, Stubhan T, Hauch J, Roch LM, Heumüller T, et al. Journal article Infrared Absorption Imaging of Water Ingress Into the Encapsulation of (Opto-)Electronic Devices (2019) Hepp J, Vetter A, Langner S, Woiton M, Jovicic G, Burlafinger K, Hauch J, et al. Journal article, Original article
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