FAU.de
Deutsch
Login
Home
Publications
Research Grants
Inventions & Patents
Awards
Additional Research Activities
Faculties & Institutions
Research Areas
Mario Sprenger
List of publications:
BibTeX-Download
Lehrstuhl für Werkstoffwissenschaften (Werkstoffkunde und Technologie der Metalle)
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Publications
(15)
Types of publications
Toggle all
Journal article
Journal article
Book chapter / Article in edited volumes
Book chapter / Article in edited volumes
Authored book
Authored book
Translation
Translation
Thesis
Thesis
Edited Volume
Edited Volume
Conference contribution
Conference contribution
Other publication type
Other publication type
Unpublished / Preprint
Unpublished / Preprint
Publication year
From
To
Abstract
Journal
Filters (inactive)
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle (2024)
Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J
Journal article
Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024)
Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J
Conference contribution
Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication (2023)
Utsch D, Häußler F, Sprenger M, Zirn J, Franke J
Conference contribution
Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization (2023)
Sprenger M, Kramer M, Tolyschew E, Steinau M, Renner D, Ottinger B, Franke J
Conference contribution
Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds (2023)
Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J
Conference contribution
High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints (2022)
Häußler F, Sippel M, Sprenger M, Liu L, Muckelbauer M, Franke J
Conference contribution
Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation (2022)
Sprenger M, Forndran F, Ottinger B, Braun T, Franke J
Conference contribution, Conference Contribution
Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test (2022)
Sippel M, Schmidt R, Kaesbauer M, Sprenger M, Hensel A, Franke J
Conference contribution
Reliability of lead-free solders for die attach in automotive power modules (2022)
Ottinger B, Holverscheid J, Konig S, Jerichow E, Lunz S, Sprenger M, Muller L, et al.
Conference contribution
Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules (2022)
Sprenger M, Noll N, Hecht C, De Greiff M, Müller L, Franke J
Conference contribution
‹
1
2
›