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Christopher Kästle
Personal Website:
http://www.faps.fau.de/person/christopher-kaestle/
List of publications:
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Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Publications
(20)
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Journal article
Journal article
Book chapter / Article in edited volumes
Book chapter / Article in edited volumes
Authored book
Authored book
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Translation
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Thesis
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Edited Volume
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Conference contribution
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Unpublished / Preprint
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Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers (2016)
Syed Khaja AH, Kästle C, Franke J
Conference contribution, Conference Contribution
Operation-oriented One-piece-flow Manufacturing: Autonomous and Smart Systems as Enabler for a Full-meshed Production Network (2016)
Scholz M, Kolb S, Kästle C, Franke J
Conference contribution, Conference Contribution
Evaluation of Influencing Factors on the Heavy Wire Bondability of Plasma Printed Copper Structures (2015)
Kästle C, Losch T, Franke J
Conference contribution, Conference Contribution
Prospects of wire bonding as an approach for contacting additive manufactured Aerosol Jet printed structures (2015)
Kästle C, Hörber J, Öchsner F, Franke J
Conference contribution, Conference Contribution
A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications (2015)
Syed Khaja AH, Kästle C, Müller M, Franke J
Journal article
Comparative Analysis of the Process Window of Aluminum and Copper Wire Bonding for Power Electronics Applications (2014)
Kästle C, Franke J
Conference contribution, Conference Contribution
Design and solder process optimization in MID technology for high power applications (2014)
Syed Khaja AH, Kästle C
Authored book, Volume of book series
Investigations on Ultrasonic Copper Wire Wedge Bonding for Power Electronics (2013)
Kästle C, Syed Khaja AH, Reinhardt A, Franke J
Conference contribution, Conference Contribution
Optimized thin-film diffusion soldering for power-electronics production (2013)
Syed Khaja AH, Kästle C, Reinhardt A, Franke J
Conference contribution, Conference Contribution
Reliable packaging technologies for power electronics: Diffusion soldering and heavy copper wire bonding (2013)
Syed Khaja AH, Kästle C, Franke J
Conference contribution, Conference Contribution
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