apl. Prof. Dr. Heinz Werner Höppel

Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften) Technische Fakultät

Advancements in metal additive manufacturing: In-situ heat treatment of aluminium alloys during the laser powder bed fusion process (2024) Schimbäck D, Kaserer L, Mair P, Mohebbi MS, Staron P, Maier-Kiener V, Letofsky-Papst I, et al. Journal article Analyzing the Precipitation Effects in Low-Alloyed Copper Alloys Containing Hafnium and Chromium (2024) Dölling J, Kuglstatter M, Prahl U, Höppel HW, Ortner P, Ott B, Kracun SF, et al. Journal article Analyzing the Precipitation Effects in Low-Alloyed Copper Alloys Containing Hafnium and Chromium (2024) Dölling J, Kuglstatter M, Prahl U, Höppel HW, Ortner P, Ott B, Kracun SF, et al. Journal article Influence of a Preageing Treatment on the Cluster Formation and the Further Ageing Route in Al–Mg–Si Extrusion Alloys (2024) Ortner P, Schiffl A, Höppel HW Journal article Detection and effects of lack of fusion defects in Hastelloy X manufactured by laser powder bed fusion (2023) Palm MS, Diepold B, Neumeier S, Höppel HW, Göken M, Zaeh MF Journal article Quantifying Co-Deformation Effects in Metallic Laminates by Loading–Unloading–Reloading Tensile Tests (2023) Pohl P, Kuglstatter M, Göken M, Höppel HW Journal article Microstructure and Mechanical Properties of Hypereutectic Al-High Si Alloys up to 70 wt.% Si-Content Produced from Pre-Alloyed and Blended Powder via Laser Powder Bed Fusion (2023) Risse JH, Trempa M, Huber F, Höppel HW, Bartels D, Schmidt M, Reimann C, Friedrich J Journal article Formation of Peripheral Coarse Grain in Thin-Walled Al–Mg–Si Extrusion Profiles (2023) Goik P, Schiffl A, Höppel HW Journal article Investigation into the influence of the interlayer temperature on machinability and microstructure of additively manufactured Ti-6Al-4V (2023) Fuchs C, Elitzer D, Höppel HW, Göken M, Zaeh MF Journal article The Role of Through-Thickness Variation of Texture and Grain Size on Bending Ductility of Al–Mg–Si Profiles (2023) Goik P, Schiffl A, Höppel HW, Göken M Conference contribution