Vitesco Technologies GmbH

Influence of material thickness and hatching strategies on laser cutting of epoxy mold composites (2024) Kohl J, Will T, Klier T, Müller L, Goth C Journal article Investigations Selected Influencing of Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-attach Method for Automotive Power Modules (2024) Ottinger B, Holverscheid J, König S, Brunner A, Müller L, Goth C, Franke J Journal article Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024) Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J Conference contribution Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation (2023) Ottinger B, Mathew A, König S, Albrecht J, Sprenger M, Müller L, Goth C, Franke J Journal article Laser welding of different pure copper materials under consideration of shielding gas influence and impact on quality relevant surface topographical features (2023) Will T, Kohl J, Hoelbling C, Mueller L, Schmidt M Journal article Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization (2023) Sprenger M, Kramer M, Tolyschew E, Steinau M, Renner D, Ottinger B, Franke J Conference contribution Prediction of electrical resistance of laser-welded copper pin-pairs with surface topographical information from inline post-process observation by optical coherence tomography (2023) Will T, Müller J, Müller R, Hölbling C, Goth C, Schmidt M Journal article Algorithms for Weld Depth Measurement in Laser Welding of Copper with Scanning Optical Coherence Tomography (2022) Will T, Garcia EM, Hoelbling C, Goth C, Schmidt M Journal article In-Process Analysis of Melt Pool Fluctuations with Scanning Optical Coherence Tomography for Laser Welding of Copper for Quality Monitoring (2022) Will T, Jeron T, Hoelbling C, Mueller L, Schmidt M Journal article Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation (2022) Sprenger M, Forndran F, Ottinger B, Braun T, Franke J Conference contribution, Conference Contribution