Technische Hochschule Aschaffenburg

University / College


Location: Aschaffenburg, Germany (DE) DE

ISNI: 00000010411138X

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

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Abstract

Journal

Tunable Bulk Polymer Planar Bragg Gratings Electrified via Femtosecond Laser Reductive Sintering of CuO Nanoparticles (2021) Kefer S, Bischoff K, Roth GL, Haubner J, Schmauß B, Hellmann R Journal article Erratum: Hypersensitive H2 sensor based on polymer planar Bragg gratings coated with Pt-loaded WO3–SiO2 (Optics Letters (2020) 45 (3601) DOI: 10.1364/OL.395341) (2020) Kefer S, Dai J, Yang M, Schmauß B, Hellmann R Journal article, Erratum Hypersensitive H2 sensor based on polymer planar Bragg gratings coated with Pt-loaded WO3-SiO2 (2020) Kefer S, Dai J, Yang M, Schmauß B, Hellmann R Journal article Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates for Surface Acoustic Wave Sensors in High Temperature Applications (2020) Schwarzer C, Hensel A, Roth F, Franke J, Kaloudis M Conference contribution Robust polymer planar bragg grating sensors embedded in commercial-grade composites (2020) Kefer S, Sauer T, Hessler S, Kaloudis M, Schmauß B, Hellmann R Journal article A new development of micro-copper sinter material for high power electronics application (2020) Schwarzer C, Chew LM, Stoll T, Franke J, Kaloudis M Conference contribution Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes (2019) Hensel A, Schwarzer C, Merz C, Stoll T, Kaloudis M, Franke J Conference contribution Multipurpose Polymer Bragg Grating-Based Optomechanical Sensor Pad (2019) Hessler S, Bott P, Kefer S, Schmauß B, Hellmann R Journal article Characterization of alternative sinter materials for power electronics (2019) Stenzel D, Schwarzer C, Schnepf M, Chew LM, Blank T, Franke J, Kaloudis M Conference contribution Investigation of pressureless sintered interconnections on plasma based additive copper metallization for 3-dimentional ceramic substrates in high temperature applications (2019) Schwarzer C, Hensel A, Roth F, Merz C, Franke J, Kaloudis M Conference contribution
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