Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
Research facility
Location:
Erlangen,
Germany (DE)
ISNI: 0000000104810543
ROR: https://ror.org/04q5rka56
A Comprehensive Approach for Safety in DC-Microgrids (2019)
Kaiser J, Strobl C, Mann H, Muhm H, Klimpel M, Schork F, März M
Conference contribution, Conference Contribution
A Cascaded Control Concept for Modular Multilevel Converters with Capacitor Voltage Estimation using a Kalman Filter (2019)
Ruccius B, Kraus T, Westermann R, Heckel T, März M, Wagner B
Conference contribution, Conference Contribution
Improving 5V digital 4H-SIC CMOS ics for operating at 400°C using PMOS channel implantation (2019)
Albrecht M, Erlbacher T, Bauer A, Frey L
Journal article, Report
Towards highly integrated, automotive power SoCs using capacitors operating at 100 V implemented in TSV (2019)
Grünler S, Rattmann G, Erlbacher T, Bauer AJ, Krach F, Frey L
Conference contribution
Silicon RC-Snubber for 900 V Applications Utilising non-Stoichiometric Silicon Nitride (2019)
Boettcher N, Heckel T, Erlbacher T, Pelaic K
Conference contribution
An isolated bidirectional half-bridge active-clamp current-fed push-pull DC/DC converter for DC microgrid applications (2019)
Schulz M, Ditze S, Diller M, Han Y, März M
Conference contribution, Conference Contribution
Performance of 4H-SIC bipolar diodes as temperature sensor at low temperatures (2019)
Di Benedetto L, Matthus C, Erlbacher T, Bauer AJ, Licciardo GD, Rubino A, Frey L
Conference contribution
Determination of compensation ratios of al-implanted 4H-SIC by tcad modelling of TLM measurements (2019)
Kocher M, Yao B, Weiße J, Rommel M, Xu ZW, Erlbacher T, Bauer A
Conference contribution
Comparison between NI-SALICIDE and self-aligned lift-off used in fabrication of ohmic contacts for sic power MOSFET (2019)
Śledziewski T, Erlbacher T, Bauer A, Frey L, Chen X, Zhao Y, Li C, Dai X
Conference contribution
On the origin of charge compensation in aluminum-implanted n-type 4H-SiC by analysis of hall effect measurements (2019)
Weiße J, Hauck M, Sledziewski T, Krieger M, Bauer A, Mitlehner H, Frey L, Erlbacher T
Conference contribution