Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)

Research facility


Location: Erlangen, Germany (DE) DE

ISNI: 0000000104810543

ROR: https://ror.org/04q5rka56

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Four Switch Buck/Boost Converter to Handle Bidirectional Power Flow in DC Subgrids (2020) Schulz M, Schleippmann N, Gosses K, Chacon R, Wunder B Conference contribution, Conference Contribution Reflective surface reconstruction from inverse deflectometric measurements (2020) Penk D, Sturm R, Seifert L, Stamminger M, Greiner G Conference contribution Packings of micron-sized spherical particles – Insights from bulk density determination, X-ray microtomography and discrete element simulations (2020) Schmidt J, Parteli EJ, Uhlmann N, Wörlein N, Wirth KE, Pöschel T, Peukert W Journal article CT-based non-destructive quantification of 3D-printed hydrogel implants (2020) Steinert J, Wittenberg T, Bednarzig V, Detsch R, Claussen J, Gerth S Conference contribution Haptic Rendering of Soft-Tissue for Training Surgical Procedures at the Larynx (2020) Eixelberger T, Parchent J, Janka RM, Stamminger M, Döllinger M, Wittenberg T Conference contribution, Conference Contribution An Iterative Surface Potential Algorithm Including Interface Traps for Compact Modeling of SiC-MOSFETs (2020) Albrecht M, Klüpfel F, Erlbacher T Journal article A 4H-SiC UV Phototransistor with Excellent Optical Gain Based on Controlled Potential Barrier (2020) Di Benedetto L, Licciardo GD, Erlbacher T, Bauer AJ, Rubino A Journal article Learned sensing: jointly optimized microscope hardware for accurate image classification (2019) Muthumbi AK, Chaware A, Kim K, Zhou KC, Konda PC, Chen RY, Judkewitz B, et al. Journal article, Original article Comprehensive accuracy examination of electrical power loss measurements of inductive components for frequencies up to 1 MHz (2019) Stolzke T, Ehrlich S, Joffe C, März M Journal article, Original article Stackable SiC-embedded ceramic packages for high-voltage and high-temperature power electronic applications (2019) Bach HL, Dirksen D, Blechinger C, Endres TM, Bayer CF, Schletz A, März M Journal article
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