Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
Research facility
Location:
Erlangen,
Germany (DE)
ISNI: 0000000104810543
ROR: https://ror.org/04q5rka56
User Experience of Alexa, Siri and Google Assistant When Controlling Music – Comparison of Four Questionnaires (2020)
Brüggemeier B, Breiter M, Kurz M, Schiwy J
Conference contribution
Low-resistance ohmic contact formation by laser annealing of N-implanted 4H-SiC (2020)
Hellinger C, Rusch O, Rommel M, Bauer AJ, Erlbacher T
Conference contribution
Out of the woods: psychophysiological investigations on wood odors to estimate their suitability as ambient scents (2020)
Schreiner L, Karacan B, Blankenagel S, Packhaeuser K, Freiherr J, Loos H
Journal article
Impact of channel implantation on a 4h-sic cmos operational amplifier for high temperature applications (2020)
Albrecht M, Pérez D, Martens R, Bauer AJ, Erlbacher T
Conference contribution
Influence of shallow pits and device design of 4H-SiC VDMOS transistors on in-line defect analysis by photoluminescence and differential interference contrast mapping (2020)
Kocher M, Schlichting H, Kallinger B, Rommel M, Bauer AJ, Erlbacher T
Conference contribution
Scanning trajectory optimisation using a quantitative Tuybased local quality estimation for robot-based X-ray computed tomography (2020)
Herl G, Hiller J, Maier A
Journal article
Development of a classification framework for technology based retail services: a retailers’ perspective (2020)
Wolpert S, Roth A
Journal article
SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction (2020)
Rettner C, Schiedermeier M, Apelsmeier A, Heckel T, Diepgen A, Klische A, Dirksen D, März M
Conference contribution, Conference Contribution
A Method for the Characterization of Adhesion Strength Degradation of Thin Films on Si-Substrate under thermal cycling test (2020)
Zhao D, Letz S, Schletz A, März M
Conference contribution, Conference Contribution
Application of Response Surface Methodology for Optimization of AgAg Direct Bonding for Wafer-Level Power Electronics Packaging (2020)
Yu Z, Zeng W, Bayer CF, Schletz A, März M
Conference contribution, Conference Contribution