Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
Research facility
Location:
Erlangen,
Germany (DE)
ISNI: 0000000104810543
ROR: https://ror.org/04q5rka56
Ferroelectric Content-Addressable Memory Cells with IGZO Channel: Impact of Retention Degradation on the Multibit Operation (2023)
Sk MR, Thunder S, Lehninger D, Sanctis S, Raffel Y, Lederer M, Jank MPM, et al.
Journal article
Experimental Assessment of LVDC-Grid Stability Optimization using Circuit Simulation and Machine Learning (2023)
Schwanninger R, Roeder G, Wienzek P, Lavery M, Wunder B, Schellenberger M, Lorentz V, März M
Conference contribution
Modelling and Design of a Droop-Based Cascaded Controller for LLC Resonant Converter (2023)
Yang X, Pohlenz S, Schwanninger R, Schleippmann N, Wunder B, März M
Conference contribution
Energy-Equivalent Inductance Measurement System (2023)
Gehring J, Nowak A, Schwanninger R, Wunder B, März M
Conference contribution
Microstructure and Mechanical Properties of Hypereutectic Al-High Si Alloys up to 70 wt.% Si-Content Produced from Pre-Alloyed and Blended Powder via Laser Powder Bed Fusion (2023)
Risse JH, Trempa M, Huber F, Höppel HW, Bartels D, Schmidt M, Reimann C, Friedrich J
Journal article
Scalable Quantum Memory Nodes using nuclear spins in Silicon Carbide (2023)
Parthasarathy SK, Kallinger B, Kaiser F, Berwian P, Dasari D, Friedrich J, Nagy R
Conference contribution
4H-SiC PIN Photodiode for VUV Detection Using an Enhanced Emitter Doping Design (2023)
Schraml M, Papathanasiou N, May A, Rommel M, Erlbacher T
Conference contribution
Device Providing DC Short-Circuit Current (2023)
Gehring J, Schwanninger R, Kaiser J, Wunder B, März M
Conference contribution
Analytical Loss Model of a Three-Level WBG NPC Inverter Comprising Reverse Conduction, Dead Time, Modulation Schemes and Switching Energy Analysis (2023)
Quergfelder S, Heckel T, März M
Conference contribution
Influence of SiC chip thickness on the power cycling capability of power electronics assemblies – A comprehensive numerical study (2023)
Zhao D, Letz S, Leib J, Schletz A
Journal article