Micro Systems Engineering

Industry / private company


Location: Berg, Germany (DE) DE

ISNI: 0000000405982779

ROR: https://ror.org/02svrcw68

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

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Abstract

Journal

Long-term electromigration study of lead-free flip-chips with solder bumps with 50 μm or 60 μm diameter employing ENIG surface finish on both chip and substrate side (2013) Gorywoda M, Dohle R, Härter S, Wirth A, Goßler J, Franke J Conference contribution