Micro Systems Engineering

Industry / private company


Location: Berg, Germany (DE) DE

ISNI: 0000000405982779

ROR: https://ror.org/02svrcw68

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Long-term electromigration study of lead-free flip-chips with solder bumps with 50 μm or 60 μm diameter employing ENIG surface finish on both chip and substrate side (2013) Gorywoda M, Dohle R, Härter S, Wirth A, Goßler J, Franke J Conference contribution