Infineon Technologies AG
Industry / private company
Location:
Neubiberg,
Germany (DE)
ISNI: 0000000405528752
ROR: https://ror.org/005kw6t15
High Frequency Characterization of Thin-Film Redistribution Layers for Embedded Wafer Level BGA (2007)
Wojnowski M, Engl M, Brunnbauer M, Pressel K, Sommer G, Weigel R
Conference contribution
Innovative Key Generation Approach to Encrypt Wireless Communication in Personal Area Networks (2007)
Bichler D, Stromberg G, Huemer M
Conference contribution
UMTS link-level demonstrations with smart antennas (2005)
Freudenthaler K, Huemer M, Maurer L, Paul S, Rupp M
Book chapter / Article in edited volumes
Evaluation of Wirebond and Flip-Chip Unterconnects of a Leadless Plastic Package for RF Applications (2005)
Engl M, Pressel K, Theuss H, Dangelmaier J, Eurskens W, Knapp H, Simbürger W, Weigel R
Conference contribution
An Embedded System Architecture for UPnP Compatible Wireless Control Networks (2004)
Bichler D, Borbely S, Fachberger M, Gsottberger Y, Huemer M, Knauseder R, Linde H, et al.
Conference contribution
A leadless packaging concept for high frequency applications (2004)
Theuss H, Dangelmaier J, Engl M, Pressel K, Knapp H, Simbürger W, Gnannt K, et al.
Conference contribution
A 29 GHz frequency divider in a miniaturized leadless flip-chip plastic package (2004)
Engl M, Pressel K, Dangelmaier J, Theuss H, Eisener B, Eurskens W, Knapp H, et al.
Conference contribution
SystemC Modelling and Simulation of Highly Integrated Baseband ICs for 2.5th Generation Mobile Phones (2003)
Huemer M, Bichler D, Dorfmair W, Knauseder R, Osterkorn C, Lüftner T
Conference contribution
Ambient Intelligence – Key Technologies in the Information Age (2003)
Weber W, Brederlow R, Briole S, Glaser R, Gsottberger Y, Halik M, Jung S, et al.
Journal article, Report