Infineon Technologies AG

Non-Intrusive Integration of Advanced Diagnosis Features in Automotive E/E-Architectures (2014) Abelein U, Cook A, Engelke P, Glaß M, Reimann F, Gómez LR, Russ T, et al. Conference contribution A low-power, low-noise, highly-linear receiver for 122 GHz applications in a SiGe BiCMOS technology (2014) Chakraborty A, Trotta S, Aufinger K, Lachner R, Weigel R Conference contribution DLTS characterization of proton-implanted silicon under varying annealing conditions (2014) Laven JG, Jelinek M, Job R, Schustereder W, Schulze HJ, Rommel M, Frey L Journal article, Original article A 70 to 90 GHz High-Linearity Multi-Band Quadrature Receiver in 0.35 μm SiGe Technology (2013) Nasr I, Lämmle B, Aufinger K, Fischer G, Weigel R, Kissinger D Journal article 60 GHz industrial radar systems in silicon-germanium technology (2013) Agethen R, Pour Mousavi SM, Forstner HP, Wojnowski M, Pressel K, Weigel R, Kissinger D Conference contribution Embedded Wafer Level Ball Grid Array (eWLB) Technology for High-Frequency System-in-Package Applications (2013) Wojnowski M, Pressel K Conference contribution Activation and dissociation of proton-induced donor profiles in silicon (2013) Laven JG, Job R, Hans Joachim S, Niedernostheide FJ, Schustereder W, Frey L Journal article, Original article High-Q Inductors Embedded in the Fan-Out Area of an eWLB (2012) Wojnowski M, Issakov V, Knoblinger G, Pressel K, Sommer G, Weigel R Journal article The thermal budget of hydrogen-related donor profiles: Diffusion-limited activation and thermal dissociation (2012) Laven J, Job R, Schulze HJ, Niedernostheide FJ, Schustereder W, Frey L Conference contribution, Conference Contribution Passive components using quasi-CPW in eWLB package (2012) Pour Mousavi SM, Wojnowski M, Pressel K, Sommer G, Weigel R Conference contribution