Infineon Technologies AG

Integrated millimeter-wave transceiver concepts and technologies for wireless multi-Gbps communication (2015) Kissinger D, Girg T, Beck C, Nasr I, Forstner HP, Wojnowski M, Pressel K, Weigel R Conference contribution, Conference Contribution Electrification of the Powertrain in Automotive Applications: “Technology Push” or “Market Pull”? (2015) Lorentz VRH, Wenger MM, John R, März M Book chapter / Article in edited volumes Application-aware cross-layer reliability analysis and optimization (2015) Aliee H, Glaß M, Chen L, Ebrahimi M, Khosravi F, Kleeberger VB, Listl A, et al. Journal article 3D rectangular waveguide integrated in embedded Wafer Level Ball Grid Array (eWLB) package (2014) Seler E, Wojnowski M, Hartner W, Bock J, Lachner R, Weigel R, Hagelauer AM Conference contribution Single- and Dual-Port 50-100-GHz Integrated Vector Network Analyzers With On-Chip Dielectric Sensors (2014) Nasr I, Nehring J, Aufinger K, Fischer G, Weigel R, Kissinger D Journal article A 50-100-GHz Highly Integrated Octave-Bandwidth Transmitter and Receiver Chipset in 0.35um SiGe Technology (2014) Nasr I, Knapp H, Aufinger K, Weigel R, Kissinger D Journal article A D-band transceiver front-end for broadband applications in a 0.35μm SiGe bipolar technology (2014) Chakraborty A, Trotta S, Wuertele J, Weigel R Conference contribution, Conference Contribution New method to increase the doping efficiency of proton implantation in a high-dose regime (2014) Jelinek M, Laven JG, Job R, Schustereder W, Schulze HJ, Rommel M, Frey L Conference contribution, Conference Contribution MeV-proton channeling in crystalline silicon (2014) Jelinek M, Schustereder W, Laven JG, Schulze HJ, Kirnstoetter S, Rommel M, Frey L Conference contribution, Conference Contribution Deep-level defects in high-dose proton implanted and high-temperature annealed silicon (2014) Jelinek M, Laven JG, Rommel M, Schustereder W, Schulze HJ, Frey L, Job R Conference contribution, Conference Contribution