Infineon Technologies AG

Experimental Study of Injected Interference Effects on Modulated Sidebands in CMOS LC VCO (2017) Rimmelspacher J, Hagelauer AM, Weigel R, Issakov V Conference contribution, Original article Highly Integrated 4-32-GHz Two-Port Vector Network Analyzers for Instrumentation and Biomedical Applications (2016) Nasr I, Nehring J, Schütz M, Dietz M, Nasr I, Aufinger K, Weigel R, Kissinger D Journal article Wearables with integrated Microwave-Sensors for Internet-of-Things-Applications (IoT) in the sector of health-care: An overview (2016) Dietz M, Guarin Aristizabal GA, Hofmann M, Nasr I, Nehring J, Lämmle B, Schwarzmeier A, et al. Conference contribution Co-simulation and Co-design of Chip-Package-Board Interfaces in Highly-Integrated RF Systems (2016) Issakov V, Wojnowski M, Knapp H, Trotta S, Forstner HP, Pressel K, Hagelauer AM Conference contribution Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology (2016) Beck C, Ng HJ, Agethen R, Pour Mousavi SM, Forstner HP, Wojnowski M, Pressel K, et al. Journal article A 4–32-GHz Chipset for a Highly Integrated Heterodyne Two-Port Vector Network Analyzer (2016) Nehring J, Dietz M, Aufinger K, Fischer G, Weigel R, Kissinger D Journal article A new behavioral model for accurate loss calculations in power semiconductors (2016) Pai AP, Reiter T, März M Conference contribution The efficiency of hydrogen-doping as a function of implantation temperature (2016) Jelinek M, Laven JG, Ganagona N, Schustereder W, Schulze HJ, Rommel M, Frey L Authored book, Volume of book series Metastable defects in proton implanted and annealed silicon (2016) Jelinek M, Laven JG, Ganagona N, Job R, Schustereder W, Schulze HJ, Rommel M, Frey L Journal article A DLTS study of hydrogen doped czochralski-grown silicon (2015) Jelinek M, Laven JG, Kirnstoetter S, Schustereder W, Schulze HJ, Rommel M, Frey L Journal article, Original article