Technische Universität München (TUM)

Correction to: Commentary of the SKLM to the EFSA opinion on risk assessment of N-nitrosamines in food (Archives of Toxicology, (2024), 98, 6, (1573-1580), 10.1007/s00204-024-03726-1) (2024) Eisenbrand G, Büttner A, Diel P, Epe B, Först P, Grune T, Haller D, et al. Journal article, Erratum Evaluation of hard palate and cleft morphology in neonates with Pierre Robin Sequence and Cleft Palate Only (2024) Willershausen I, Krautkremer N, Ströbel A, Abu-Tair T, Paulsen F, Strobel K, Kopp M, et al. Journal article Noninvasive Electromagnetic Phrenic Nerve Stimulation in Critically Ill Patients: A Feasibility Study (2024) Panelli A, Grimm AM, Krause S, Verfuß MA, Ulm B, Grunow JJ, Bartels HG, et al. Journal article Computing solution spaces for gear box design (2024) Ziegler K, Demir K, Luft T, Mucks T, Fürst M, Otto M, Stahl K, et al. Conference contribution Targeting TGFβ-activated kinase-1 activation in microglia reduces CAR T immune effector cell-associated neurotoxicity syndrome (2024) Vinnakota JM, Biavasco F, Schwabenland M, Chhatbar C, Adams RC, Erny D, Duquesne S, et al. Journal article Efficacy of an Internet- and Mobile-Based Intervention for Subclinical Anxiety and Depression (ICare Prevent) with Two Guidance Formats: Results from a Three-Armed Randomized Controlled Trial (2024) Zarski AC, Weisel K, Berger T, Krieger T, Schaub MP, Berking M, Görlich D, et al. Journal article A lightweight sensor ontology for supporting sensor selection, deployment, and data processing in forming processes (2024) Vogel-Heuser B, Vicaria A, Ji F, Höfgen J, Jäckisch M, Lechner M, Merklein M Journal article FAIR Internet of Things Data: Enabling Process Optimization at Munich Airport (2024) Freund M, Rott J, Dorsch R, Harth A Conference contribution, Conference Contribution LST-AI: A deep learning ensemble for accurate MS lesion segmentation (2024) Wiltgen T, McGinnis J, Schlaeger S, Kofler F, Voon CC, Berthele A, Bischl D, et al. Journal article Ultra-Low Power 60 GHz Class-C Frequency Tripler in 22-nm FDSOI CMOS Technology (2024) Gupta A, Dietz M, Engelmann A, Hagelauer A Conference contribution