Institute Materials for Electronics and Energy Technology (i-MEET)


close-button

Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Perfluoroalkylsulfonyl ammonium for humidity- resistant printing high-performance phase-pure FAPbI3 perovskite solar cells and modules (2024) Chen X, Yang F, Yuan L, Huang S, Gu H, Wu X, Shen Y, et al. Journal article Cost-efficient recycling of organic photovoltaic devices (2024) Sun R, Yuan X, Yang X, Wu Y, Shao Y, Wu X, Brabec C, Min J Journal article Simulation of Carrier Injection Efficiency in AlGaN-based UV-light-emitting Diodes (2024) Hofmann G, Muhin A, Susilo N, Römer F, Wernicke T, Kneissl M, Witzigmann B Journal article Approach For Optimized Dismantling Strategies And Design For Recycling Of Electric Traction Drives (2024) Hahn R, Wieprecht N, Ihne T, Kühl A, Franke J Conference contribution, Conference Contribution Bi-directional DC Charging Stations for EVs on renewable-powered LVDC Grids: Design, Sizing, Control and Testing (2024) Gutwald B, Lehmann R, Barth M, Reichenstein T, Franke J Conference contribution Bottom Contact Engineering for Ambient Fabrication of >25% Durable Perovskite Solar Cells (2024) Yuan L, Zou S, Zhang K, Huang P, Dong Y, Wang J, Fan K, et al. Journal article Dewetting of Pt Nanoparticles Boosts Electrocatalytic Hydrogen Evolution Due to Electronic Metal-Support Interaction (2024) Harsha S, Sharma RK, Dierner M, Baeumer C, Makhotkin I, Mul G, Ghigna P, et al. Journal article Advanced Light Management for Encapsulated Silicon Solar Cells: An Antireflective Textured Film with a Down-Shifting Lead-free Perovskite Cs2AgxNa1-xBiyIn1-yCl6 Phosphor (2024) Kong M, Raievska O, Stroyuk O, Barabash A, Wu Z, Tian J, Erban C, et al. Journal article Pt Single Atoms Loaded on Thin-Layer TiO2 Electrodes: Electrochemical and Photocatalytic Features (2024) Zhou X, Wang Y, Denisov N, Kim H, Kim JH, Will J, Spiecker E, et al. Journal article Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024) Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J Conference contribution