Department Maschinenbau


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Consequences of Thermodynamical Balances (2022) Steinmann P Book chapter / Article in edited volumes Nonlinear pulse compression of a thin-disk amplifier and contrast enhancement via nonlinear ellipse rotation (2022) Pfaff Y, Forster C, Barbiero G, Rampp M, Klingebiel S, Brons J, Teisset CY, et al. Journal article Enhancing Photoelectric Powder Deposition of Polymers by Charge Control Substances (2022) Düsenberg B, Kopp SP, Tischer F, Schrüfer S, Schmidt J, Schmidt M, Schubert DW, et al. Journal article A nonlocal interface approach to peridynamics exemplified by continuum‐kinematics‐inspired peridynamics (2022) Laurien M, Javili A, Steinmann P Journal article Evaluation of DLC, MoS2, and Ti3C2Tx thin films for triboelectric nanogenerators (2022) Tremmel S, Luo X, Rothammer B, Seynstahl A, Wang B, Rosenkranz A, Marian M, Zhu L Journal article Derivation and Validation of Linear Elastic Orthotropic Material Properties for Short Fibre Reinforced FLM Parts (2022) Witzgall C, Völkl H, Wartzack S Journal article, Original article On the Transient Effects at the Beginning of 3D Elastic-Plastic Rolling Contacts for a Circular Point Contact Considering Isotropic Hardening (2022) Jüttner M, Bartz M, Tremmel S, Wartzack S Journal article, Online publication Investigation of the influence of formed, non-rotationally symmetrical pin geometries and their effect on the joint quality of steel and aluminium sheets by direct pin pressing (2022) Römisch D, Kraus M, Merklein M Journal article Highly Dynamic 2-DOF Cable-Driven Robotic Wrist based on a Novel Topology (2022) Nemoto T, Walter J, Bachmann C, Gerlich M, Reitelshöfer S, Franke J Journal article Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation (2022) Sprenger M, Forndran F, Ottinger B, Braun T, Franke J Conference contribution, Conference Contribution