Department Maschinenbau


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Variational integrators for multirate systems and holonomically constrained systems (2026) Wenger T Thesis Derivation of the class of equivalent standard direct/indirect approaches utilising a control Lagrangian framework (2026) Konopik M, Leyendecker S, Maslovskaya S, Ober-Blöbaum S, Sato Martin de Almagro R Conference contribution Enhancing numerical robustness in geodesic muscle path computation via a local parameterisation (2026) Chen X, Heinrich S, Martelli S, Pivonka P, Leyendecker S, Lavaill M Conference contribution, Conference Contribution Using bed rest study data to support load estimation on the distal human tibia for simulating bone loss during mechanical disuse (2026) Tran T, Müller A, Lepileur M, Mühl Castoldi N, Vico L, Niehoff A, Pivonka P, et al. Conference contribution, Conference Contribution Multiscale Fracture Modeling of Amorphous Materials: Bridging Atomistic and Continuum Mechanical Perspectives (2026) Weber F Thesis Context-sensitive decision support for the design of user-friendly and emotionally appealing products Kontextsensitive Entscheidungsunterstützung für die Gestaltung gebrauchstauglicher und emotional ansprechender Produkte (2026) Wartzack S, Miehling J, van Remmen JS Journal article Grundlegende Untersuchung zur Eigenschaftsgradierung pressgehärteter Bauteile durch partielle Zwischenkühlung (2026) Reihani Masouleh A Other publication type, text-doctoralthesis Crossover frequency as a model-independent viscoelastic constant for soft tissue biomechanics (2026) Ruhland L, Schattenfroh J, Guo J, Sack I, Willner K Journal article Framework for considering variations in composite products Framework zur Berücksichtigung von Abweichungen bei FKV-Produkten (2026) Freitag S, Götz S, Wartzack S Journal article Near-Chip 3D Functionalization of Direct Copper Bonded Substrates in Power Electronic Modules (2026) Hecht C, Wiegand D, Sippel M, Franke J, Ockel M Conference contribution