Lehrstuhl für Technische Elektronik (LTE)

Reallocation / Closing: 31.08.2024


close-button

Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Area-Efficient Fully Integrated Dual-Band Class-E/F Power Amplifier with Switchable Output Power for a BPSK/OOK Transmitter (2017) Söll C, Röber J, Milosiu H, Weigel R, Hagelauer AM Conference contribution, Conference Contribution A 10 Gb/s Highly-Integrated Adaptive Pseudo-Noise Transmitter for Biomedical Applications (2017) Schmidt C, Nehring J, Dietz M, Weigel R, Kissinger D, Hagelauer AM Conference contribution SDR Implementation of an Adaptive Low-Latency IEEE 802.11p Transmitter System for Real-Time Wireless Applications (2017) Kloc M, Weigel R, Kölpin A Conference contribution Segmental Polynomial Approximation based Phase Error Correction for Precise Near Field Displacement Measurements using Six-Port Microwave Interferometers (2017) Will C, Linz S, Mann S, Lurz F, Lindner S, Weigel R, Kölpin A Conference contribution, Conference Contribution Error Compensation of the Temperature Influence on Radar based Displacement Measurements (2017) Will C, Mann S, Michler F, Reißland T, Lurz F, Weigel R, Kölpin A Conference contribution, Conference Contribution RSSI-based Localization With Minimal Infrastructure Using Multivariate Statistic Techniques (2017) Pflaum F, Erhardt S, Weigel R, Kölpin A Conference contribution In-Line Material Characterization Sensors Operating at 10 GHz and 77 GHz (2017) Frank M, Talai A, Weigel R, Kölpin A Conference contribution, Conference Contribution Broadband Low Power Transmitter Based in SiGe Technology on Maximum Length Sequences (2016) Radwan A Thesis A Digital Power Amplifier in 28 nm CMOS for LTE Applications (2016) Fuhrmann J Thesis Differential wideband interconnects for organic millimeter wave chip packages - An effort to design an all-purpose RF chip package (2016) Röhrl FX, Bogner W, Jakob J, Hageneder D, Zorn S Conference contribution