Lehrstuhl für Technische Elektronik (LTE)

Reallocation / Closing: 31.08.2024


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Design challenges of a highly integrated SDR platform for multiband spacecraft applications in radiation enviroments (2018) Kölpin A, Budroweit J Conference contribution, Conference Contribution 3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band (2018) Lomakin K, Simon D, Sippel M, Gold G, Helmreich K, Seler E, Tong Z, Reuter R Conference contribution A Resonant Substrate Integrated Waveguide Measurement System for True Relative Permittivity Extraction of PCB Materials up to 90 GHz (2018) Lau I, Michler F, Talai A, Weigel R, Kölpin A Conference contribution, Conference Contribution Enhanced GSM Broadcast Receiver using the Phase Output of a Sub-GHz Transceiver (2018) Erhardt S, Gäde B, Kölpin A, Weigel R Conference contribution, Conference Contribution Experimental Comparison of Integrated Transformers in a 28 nm Bulk CMOS Technology (2018) Rimmelspacher J, Breun S, Werthof A, Geiselbrechtinger A, Weigel R, Issakov V Conference contribution, Conference Contribution Examination of OFDM for Wireless Train-Onboard Communication (2018) Lichtblau J, Sanftl B, Lurz F, Weigel R, Kölpin A Conference contribution, Conference Contribution Low-Power Frequency Synthesizer for Multi-Tone Six-Port Radar (2018) Lurz F, Hofstetter P, Lindner S, Linz S, Michler F, Weigel R, Kölpin A Conference contribution A Low-Power Wideband D-Band LNA in a 130 nm BiCMOS Technology for Imaging Applications (2018) Aguilar Mendoza E, Hagelauer AM, Kissinger D, Weigel R Conference contribution, Conference Contribution Microw(h)att?! Ultralow-Power Six-Port Radar (2018) Lurz F, Michler F, Scheiner B, Weigel R, Kölpin A Journal article Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies (2018) Hagelauer AM, Wojnowski M, Pressel K, Weigel R, Kissinger D Journal article, Review article