Department Elektrotechnik-Elektronik-Informationstechnik (EEI)


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Experimenting with Lapped Transforms in Numerical Computation Libraries using Polyphase Matrices and Strided Memory Views (2019) Werner N, Edler B Conference contribution Perceptual Audio Coding with Adaptive Non-Uniform Time/Frequency Tilings using Subband Merging and Time Domain Aliasing Reduction (2019) Werner N, Edler B Conference contribution Analytical Equivalent Circuit Extraction Procedure for Broadband Scalable Modeling of Three-Port Center-Tapped Symmetric On-Chip Inductors (2019) Issakov V, Kehl-Waas S, Breun S Journal article Frequency Response Characterization of Surface Acoustic Wave Resonators Using a Six-Port Frequency Measurement System (2019) Scheiner B, Lurz F, Michler F, Weigel R, Kölpin A Conference contribution, Conference Contribution Backstepping control of coupled linear parabolic PDEs with space and time dependent coefficients (2019) Kerschbaum S, Deutscher J Journal article SCT-based priority-free conditionally-preemptive scheduling of modular real-time systems with exact task execution time (2019) Wang X, Li Z, Moor T Journal article An isolated bidirectional half-bridge active-clamp current-fed push-pull DC/DC converter for DC microgrid applications (2019) Schulz M, Ditze S, Diller M, Han Y, März M Conference contribution, Conference Contribution Performance of 4H-SIC bipolar diodes as temperature sensor at low temperatures (2019) Di Benedetto L, Matthus C, Erlbacher T, Bauer AJ, Licciardo GD, Rubino A, Frey L Conference contribution Determination of compensation ratios of al-implanted 4H-SIC by tcad modelling of TLM measurements (2019) Kocher M, Yao B, Weiße J, Rommel M, Xu ZW, Erlbacher T, Bauer A Conference contribution Comparison between NI-SALICIDE and self-aligned lift-off used in fabrication of ohmic contacts for sic power MOSFET (2019) Śledziewski T, Erlbacher T, Bauer A, Frey L, Chen X, Zhao Y, Li C, Dai X Conference contribution